| 圖片 | 型號(hào) | 品牌 | 封裝 | 數(shù)量 | 描述 | PDF資料 |
|---|---|---|---|---|---|---|
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ZSSC3136BE1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3136BE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3136BE1D | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3138BA1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3138BE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3154BA1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3154BE1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3154BE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3154BE1D | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3170EA1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3170EA1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3170EA1D | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3170EE1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3170EE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3170EE1D | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
|
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ZSSC3170FE1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3170FE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3218BI1B ES | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3218BI1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3218BI1D ES | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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